1. Non-destructive Testing Capability

It can penetrate various materials such as metals, ceramics and plastics without damaging samples, and detect micron-level internal defects including delaminations, cracks and voids.

It is applicable to the full-process quality control of precision devices such as semiconductor wafers, IGBT modules and plastic-encapsulated ICs, avoiding material loss caused by traditional destructive testing.

2. High Resolution and Sensitivity

Adopting high-frequency ultrasonic waves (≥30 MHz), it achieves micron-level resolution, accurately identifying unbonded areas at wafer bonding interfaces and tiny debonding caused by nanoparticles.

By comparing acoustic impedance differences, it sensitively captures interlayer bonding defects and micro inclusions in composite materials, such as microcracks in ceramic substrates.

3. 3D Imaging and Multi-dimensional Analysis

It supports C-scan (planar imaging), B-scan (cross-sectional imaging) and 3D tomographic reconstruction, visually displaying the spatial distribution and size of defects.

Combined with phase inversion analysis, it distinguishes phase differences of interface reflected signals and reduces the misjudgment rate.

4. Wide Applicability

Compatible with metals, ceramics, polymers, biological tissues and other materials, not limited by material transparency or electrical conductivity.

It can detect solder ball voids, underfill delaminations, and thermal expansion mismatch defects at heterogeneous integration interfaces inside electronic packages.

5. Non-contact Testing and Easy Operation

Acoustic waves are transmitted through coupling liquids such as water or oil, avoiding device damage and contamination caused by physical contact.

The automatic scanning function simplifies operation procedures and supports batch testing as well as real-time dynamic imaging.

6. Process Compatibility and Reliability Verification

It adapts to advanced semiconductor packaging processes (Flip Chip, 3D packaging), and online monitors the influence of bonding pressure and temperature parameters on interface quality.

For failure analysis, it can track the propagation trend of defects under thermal cycling and mechanical stress, and evaluate the long-term reliability of devices.

Core Value

With micron-level defect detection, multi-dimensional imaging and non-destructive characteristics, the scanning acoustic microscope has become an essential tool for quality control in semiconductor manufacturing, electronic packaging and material science.